Analog Devices Inc. LTM4643 Ultrathin Quad μModule® Regulators
Analog Devices Inc. LTM4643 Ultrathin Quad μModule® Regulators are quad DC/DC step-down power modules with 3A per output. The outputs can be paralleled in an array for up to a 12A capability. The LTM4643 includes switching controllers, power FETs, inductors and all support components. The regulators operate over a 4V to 20V input voltage range or 2.375V to 20V with an external bias supply. The LTM4643 supports a 0.6-3.3V output voltage range each set by a single external resistor. Analog Devices regulators provide a high efficiency design that delivers 3A of continuous output current per channel. Only bulk input and output capacitors are needed.
Features
- Quad output step-down μModule regulator with 3A per output
- 4V to 20V input voltage range
- 2.375V to 20V with external bias
- 0.6V to 3.3V output voltage
- 3A DC output current each channel
- ±1.5% total output voltage regulation
- Current mode control, fast transient response
- Parallelable for higher output current
- Internal temperature sensing diode output
- Output voltage tracking
- External frequency synchronization
- Overvoltage, current, and temperature protection
- 9mm × 15mm × 1.82mm LGA and 9mm × 15mm × 2.42mm BGA packages
Applications
- FPGAs, GPUs, and ASICs
- PCIe and backside PCB mounting
Typical Application
LTM4643EV Demonstration Circuit
Analog Devices Inc. LTM4643EV Demonstration Circuit features the LTM®4643 µModule regulator. The demonstration circuit is the easiest way to evaluate the performance of the LTM4643. The LTM4643 is a high-performance high-efficiency 4-output step-down regulator. The LTM4643 demonstration circuit has an operating input voltage range of 4V to 20V and is able to provide up to 3A out output current from each of its phases. The LTM4643EV is a complete DC/DC point of load regulator housed in a thermally enhanced 15mm × 9mm × 1.82mm LGA package requiring only a few input and output capacitors.
View Product Detail
Related Products
Analog Devices Inc. µModule® Power Products
System-in-package power management solutions housed in compact, surface-mount BGA or LGA packages.
Published: 2017-04-26
| Updated: 2022-03-11