Apacer Technology Inc. 8GB ECC DDR4 SDRAM UDIMM Memory Module

Apacer Technology Inc. 8GB ECC DDR4 SDRAM Memory Module is a 1024M x 72 DDR4 SDRAM (Synchronous DRAM) ECC DIMM. The D32.27245S.002 SDRAM, high-density memory module, consists of 9 pieces 1024M x 8-bits DDR4 synchronous DRAMs in FBGA packages and a 4K Bits EEPROM. The Apacer 8GB, ECC DDR4 SDRAM, offers 288-pins dual in-line memory designed for mounting into a connector socket.


  • Functionality and operations comply with the DDR4 SDRAM datasheet
  • Bank grouping is applied, and CAS to CAS latency (tCCD_L, tCCD_S) for the banks in the same or different bank group accesses are available
  • Bi-directional differential data strobe
  • 8-bit pre-fetch
  • Burst Length (BL) switch on-the-fly BL8 or BC4 (Burst Chop)
  • Supports ECC error correction and detection
  • Per DRAM Addressability is supported
  • Internal Vref DQ level generation is available
  • Write CRC is supported at all speed grades
  • DBI (Data Bus Inversion) is supported (x8)
  • CA parity (Command/Address Parity) mode is supported


  • Support ECC error detection and correction
  • On-DIMM thermal sensor
  • 1024 words x 72 bits, 1 rank Organization
  • Integrating 9 pieces of 8G bits DDR4 SDRAM sealed FBGA
  • 288-pin Socket type dual in-line memory module (ECC DIMM) package
  • Height 31.25mm, lead pitch 0.85mm (pin) PCB
  • Serial Presence Detect (SPD)
  • VDD = 1.2V (1.14V to 1.26V) Power supply
  • VDDQ = 1.2V (1.14V to 1.26V)
  • VPP = 2.5V (2.375V to 2.75V)
  • VDDSPD = 2.2V to 3.6V
  • 16 internal banks (4 Bank groups)
  • CAS Latency (CL): 10, 11, 12, 13, 14, 15,16,17,18,19, 20, 21, 22, 24
  • CAS Write Latency (CWL): 16, 20
  • Support industrial temp ( -40°C~95°C )
    • tREFI 7.8us at -40 °C ≤ TCASE ≤ 85°C
    • tREFI 3.9us at 85 °C < TCASE ≤ 95°C
  • Lead-free (RoHS compliant)
  • Halogen free
  • 30µ inch gold finger PCB
Published: 2021-06-02 | Updated: 2022-03-11