Bosch BHI260AP Shuttle Board 3.0

Bosch Sensortec BHI260AP Shuttle Board 3.0 is a PCB with the smart sensor BHI260AP installed. The application board 3.0 combined with the BHI260AP Shuttle Board 3.0 allows various functionalities to be evaluated, provided by the BHI260AP.

The Bosch Sensortec BHI260AP Shuttle Board 3.0 measures the BHI260AP current consumption (over VDD) and adds software inside the BHI260AP. The shuttle board allows easy access to the sensor pins via a simple socket.

The BHI260AP Shuttle Board version 3.0 enables directly plugging into Bosch Sensortec’s application board 3.0.

Features

  • Components:
    • BHI260AP smart sensor
    • BME688 environmental sensor (I2C interface)
    • BMP390Lpressure sensor (I2C interface)
    • BMM150 magnetometer (AUX Interface)
    • W25Q32FWSSI flash memory 4M (QSPI Interface)
    • On-board EEPROM

Dimensions mm

Mechanical Drawing - Bosch BHI260AP Shuttle Board 3.0
Published: 2021-09-13 | Updated: 2022-03-11